Article No. 027501
Product specifications
The stated values represent typical product characteristics and are not to be construed as binding product specifications.
Field of application
- Mould control and prevention in existing buildings
- Implementation of the hygienic minimum heat insulation level in existing buildings
- Improving the room climate by increasing the wall surface temperature
Properties
- Thermally insulating and mould inhibiting
- Enables water vapour diffusion
- Capillary-active
- Free from quartz sands and quartz powders
- Thermal conductivity (nominal value) approx. 0.07 W/(m•K)
- Building material class A1 (non-combustible)
- Low construction height
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Preparation
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Substrate requirements
The substrate must be clean and capable of bearing a load.
The substrate must be level.
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Preparations
Level off and even out highly uneven substrates – use SP Level to close up joints and even out surfaces.
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Application
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Pre-wet the substrate.
Apply SLP Fix as a scratch coat on the rear face of the board and on the substrate.
Using a toothed spatula, apply SLP Fix wet-on-wet to the rear face of the panel and to the substrate.
Position and press on the boards from the bottom up.
Align using a floating rule.
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Application instructions
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Mark the desired dimensions on the board.
Cut using a jigsaw or hand-held circular saw.
Rework the cut edges with a rasp or file if necessary.
Avoid cross joints.
Make sure that full-surface bonding is achieved.
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Storage / shelf life
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Dry and frost-free.
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General information
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Current regulations and legal requirements must be taken into account and deviations from these must be agreed separately.
The relevant test certificates must be observed when planning and carrying out work.
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Disposal instructions
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The product must be disposed of in accordance with the official regulations.
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